FeAs-based superconductivity: a case study of the effects of transition metal doping on BaFe2As2

The recently discovered FeAs-based superconductors are a new, promising set of materials for both technological as well as basic research. They offer transition temperatures as high as 55 K as well as essentially isotropic and extremely large upper, superconducting critical fields in excess of 40 T at 20 K. In addition they may well provide insight into exotic superconductivity that extends beyond just FeAs-based superconductivity, perhaps even shedding light on the still perplexing CuO-based high-Tc materials. Whereas superconductivity can be induced in the RFeAsO (R = rare earth) and AEFe2As2 (AE = Ba, Sr, Ca)) families by a number of means, transition metal doping of BaFe2As2, e.g. Ba(Fe1-xTMx)2As2, offers the easiest experimental access to a wide set of materials. In this review we present an overview and summary of the effect of TM doping (TM = Co, Ni, Cu, Pd, and Rh) on BaFe2As2. The resulting phase diagrams reveal the nature of the interaction between the structural, magnetic and superconducting phase transitions in these compounds and delineate a region of phase space that allows for the stabilization of superconductivity.Comment: edited and shortened version is accepted to AR:Condensed Matter Physic

An analysis of turbulent diffusion flame in axisymmetric jet

The kinetic theory of turbulent flow was employed to study the mixing limited combustion of hydrogen in axisymmetric jets. The integro-differential equations in two spatial and three velocity coordinates describing the combustion were reduced to a set of hyperbolic partial differential equations in the two spatial coordinates by a binodal approximation. The MacCormick's finite difference method was then employed for solution. The flame length was longer than that predicted by the flame-sheet analysis, and was found to be in general agreement with a recent experimental result. Increase of the turbulence energy and scale resulted in an enhancement of the combustion rate and, hence, in a shorter flame length. Details of the numerical method as well as of the physical findings are discussed

Stochastics theory of log-periodic patterns

We introduce an analytical model based on birth-death clustering processes to help understanding the empirical log-periodic corrections to power-law scaling and the finite-time singularity as reported in several domains including rupture, earthquakes, world population and financial systems. In our stochastics theory log-periodicities are a consequence of transient clusters induced by an entropy-like term that may reflect the amount of cooperative information carried by the state of a large system of different species. The clustering completion rates for the system are assumed to be given by a simple linear death process. The singularity at t_{o} is derived in terms of birth-death clustering coefficients.Comment: LaTeX, 1 ps figure - To appear J. Phys. A: Math & Ge

Stress-Induced Delamination Of Through Silicon Via Structures

Continuous scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently three-dimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effect of thermal stresses on interfacial reliability of TSV structures. First, the three-dimensional distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semi-analytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results obtained by finite element analysis (FEA). Results from the stress analysis suggest interfacial delamination as a potential failure mechanism for the TSV structure. Analytical solutions for various TSV designs are then obtained for the steady-state energy release rate as an upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. Based on these results, the effects of TSV designs and via material properties on the interfacial reliability are elucidated. Finally, potential failure mechanisms for TSV pop-up due to interfacial fracture are discussed.Aerospace Engineerin